May 16 – 18 – 2017 – Nuremberg, Germany
The SMT Hybrid Packaging, Europe’s leading event on System Integration in Micro Electronics – the perfect information platform for you.
It shows all technical processes that the production of electronic modules involves: from the idea and development through to the manufacturing process. Experience the entire spectrum of surface-mount and packaging technologies.
The international trade fair together with the parallel conference sees itself as a meeting place for all areas of electronics manufacture, a platform for showcasing new developments and as an important driver for the entire manufacturing process within microelectronics.
Visit us on booth 5-409, we can give you full support in package development, from the designing stage to mass production.
For more information regarding the SMT please click on the banner below.