14 – 17 November – 2017 – Munchen, Germany
Invitation to visit us during the Productronica exhibition
Meet us at Hall B2, Booth 262
Our focus this time: Automotive electronics, Power Modules, Wafer Level Packaging and Large Panel Molding.
Automotive electronics can be classified into: Engine electronics, Transmission electronics, Chassis electronics, Active safety, Driver assistance, Passenger comfort and Entertainment systems.
The many Semiconductors, Sensors, Electronic Modules, (A modern car may have up to 100 ECU’s), require specific packaging solutions. The trend is to make these more reliable, smaller and cheaper. We are the experts for this.
Power modules are the heart of electric vehicles (EVs) and hybrid’s (HV’s), they are also widely found in inverters for renewable energies as wind turbines, solar power panels and tidal power plants. These modules must often operate in harsh environments. Therefore the epoxy packaging solutions we can offer you, meet or exceed the industry’s toughest reliability and quality requirements.
Wafer Level Packaging and Large Panel Molding
Wafer level packaging and embedding of active components into printed circuit boards (Chip-in-Polymer) are two major packaging trends. Internet of Things, Wearables and similar applications ask for further cost reduction, which means more efficient processes on large production formats, i.e. the introduction of Panel Level Packaging (PLP). We at Towa Europe B.V. PDC have already a lot of experience with these new trends and we can help you to develop the best packaging solution. Our systems can mold wafers up to 450 mm as well as very large panels.
TOWA Europe Packaging Development Center
Since the opening in February 2014 TOWA Europe PDC, has become a leader in package development, The importance of an European Packaging Development Center to assist European companies and institutes in developing the best packaging solutions for their innovative products has become quite clear. The Towa Europe PDC Moldlab is equipped with latest state of the art compression and transfer molding systems and tools in a clean room environment. We at TOWA Europe B.V. PDC are experts in package design. We can mold prototype products and do pilot production for Semiconductors, LED’s, MEMS, Sensors, Automotive Electronics and Power Modules. Cost reduction can be realized with smart designs. The packaging solutions we can offer you meet or exceed the industry’s toughest reliability and quality requirements.
The TOWA Corporation of Japan founded in 1979, is a leading supplier of Molding and Singulation equipment for the global semiconductor and electronics industries. TOWA Europe B.V. PDC is a fully owned subsidiary of the TOWA Corporation of Japan, located Geograaf 14, 6921 EW Duiven, the Netherlands’
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