Perfect for ultra-thin package and high-density large Substrate.
Also effective for the following types of packages.
- Suitable for ultra-thin Chip, Mold and Substrate.
- Applicable for Single Cap molding of Large Substrate (e.g. MAP-BGA).
- Low pressure molding makes it possible to mold Low-K devices.
- Ideal for reducing wire sweep problems on fine-pitch and long wires.
- 100% molding compound utilization rate minimizes costs and waste.